Miniaturization and multi-function have always been the development goal of electronic component packaging technology. With the development of electronic component packaging technology, electronic assembly technology has also experienced four stages: manual welding, immersion welding, wave soldering and surface assembly.
Surface assembly technology is originated from the short lead flat installation technology used by communication satellites in the United States, but its rapid development and maturity are driven by the demand of large-scale production of color TV tuners. With the maturity of SMT SMT SMT surface assembly line technology, which in turn drives
By the early 1990s, we could basically purchase all kinds of electronic components in surface assembly package. The rapid development of surface assembly technology, compared with plug-in technology,
It has four outstanding advantages:
(1) high assembly density. This is the main advantage. It makes it possible for electronic products to be miniaturized and multifunctional. Without it, there would be no smart phone today.
(2) high reliability.
(3) high frequency performance.
(4) adapt to automation. Compared with plug-in components, surface assembly components are more suitable for automatic assembly, which not only improves the production efficiency, but also improves the quality of solder joints.
Driven by the demand of smaller, more functions and longer standby time of mobile devices, surface assembly technology is developing rapidly towards micro assembly technology. In the future, the surface assembly technology will be further integrated with the packaging technology of components, moving towards the so-called post-smt era
The development of PCBA processing to a higher level provides favorable support.