Process requirements for picosecond laser products:
1. The requirement for assembly is 0.1mm. Because BGA is widely used now, the steel mesh cannot be used very thick, so the steel mesh with the right of use of 0.12mm is generally used. If the flatness exceeds this value, it may cause poor empty welding, false welding, etc
2. There is no fixed requirement for the flatness of circuit board products. Of course, it is better to have a small flatness. Generally, both positive and negative 1mm can be welded
3. It is not allowed to have defects such as missing parts, multiple parts, wrong parts, reverse pasting, monument erection, false welding, empty welding, continuous welding, cold welding and other adverse phenomena that seriously affect the product performance in circuit board assembly.
4. No crack or crack is allowed in the welding.
5. A complete test report is required.