Ceramic material has the advantages of high thermal conductivity, good chemical stability, high thermal stability and melting point, which is very suitable for making circuit board and applying in the electronic field.
The advantages of ceramic circuit board also retain the characteristics of its materials, and unlike the traditional PCB needs to use insulating medium as the insulating layer, ceramic itself is the insulating layer. At the same time, it also has high frequency and low dielectric constant, because its manufacturing process is easier in light, thin and miniaturization. And its shortcomings are obvious. Raw materials are more expensive and expensive than traditional PCB. And the manufacturing area is small, large area is difficult to produce, more application of high-end products, low-end products will not be used. Moreover, the processing difficulty is relatively large, because of the high hardness and density, it is easy to break during the processing. In addition, due to the low toughness and friability of ceramic materials, the scrap rate in each process is relatively high. The final surface metallization is also a high cost of equipment in the early stage. However, as a new product, ceramic PCB is very suitable for the development of this intelligent era, and its shortcomings are constantly improving. A number of new ceramic materials such as toughened alumina ceramics are manufactured, which increases its toughness and reduces its brittleness.