BGA mounting range is 0.18mm-0.4mm, and the minimum packaging material is 01005;
Maximum plate thickness: 46 layers;
Minimum line width / spacing: 3mil / 3mil;
BGA spacing: 0.25mm;
Minimum diameter of finished product: 0.1mm;
Maximum size: 610mmx1200mm;
Thickness: 0.3-3.5mm.
Production equipment: 1 mydata solder paste printer, 1 solder paste detector, 2 mydata mounter, 3 Yamaha mounter, 3 reflow soldering and 1 wave soldering.